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technical notes  note tecniche


Reflow: Convective versus Conductive and vice-versa

In the today market there are available several products from different makers to perform any printed board assembly-re-work task, satisfying therefore any needs. The Etneo range of products includes "non contact" and "contact" specific products; those working techniques are know as Convective and Conductive. Both methods present some advantages and some disadvantages. Etneo which has been founded in the 1919, and is manufacturing this kind of products since the early Seventies, did include the best aspects of the two methodology on the products made, therefore Our Customer is helped to choose the most suitable "tool" for his kind of work, leaving to himself the privilege of the final choice.

FP Contact toolNon Contact Hot Air toolPin pointed hot air flow allowing low temperaturesVacuum lift up SMD not destroying pcb traces and padsBGA rework, obviously by controlled Hot AirSMD components with high pin countEtneo easy re=place - Bga Rework system with TOP and BOTTOM Temperatures and flows controlled "HOT AIR BATH"Pin point soldering ironMulti functions Rework centre which includes CONTACT and NON CONTACT toolsLess Flow volume settingMore Flow volume settingGo with the desired flow set

Etneo  introduces innovations in both techniques

Etneo manufactures the World's First Hot air pencil Tool with airflow volume control in the handle, at the operator finger touch - dramatic and compounding advantage -
Etneo manufactures contact FP tool with AQP & AFP tips range having the vacuum suction feature to minimize and helping to eliminate the disadvantages of the contact method (risk of bringing contamination into the pcb assembly as residues of flux and dirt)
Thanks to this feature, the operator does not have to twist the tool to remove the SMDs, eliminating therefore the risk of destroying traces and pads, and the tips they have not to be precise in sizes to the components dimensions, allowing the use of the same tip for several SMDs with near sizes, with undoable advantages on the tips range to be bought

Contact Rework methods: Conductive

Conductive rework tools are generally less expensive than hot air and infrared rework systems. These systems cannot focus heat delivery as well as conductive tools, which focus heat on the leads of the component being removed. Solder ball formation and reflow of adjacent components  is a  problem may arise with some hot air systems.

the Etneo FP tool offers remarkable advantages

  • it is fast
  • it delivers heat only to the SMD leads
  • does not damage pc board traces and pads
  • the tips have a vacuum features that lift up the SMD smoothly and without have to move the tool
  • tips range covers several components sizes
  • vacuum activation by the unique Etneo key finger control
  • interchangeable suction cups
  • AQP series for square, rectangular JLEADED and GULL WING LEADED devices
  • AFP series for any discrete devices

Non Contact Rework methods: Convective

The Etneo Hot Air systems have been designed with the main concept that both the equipment and the process of rework and repair  of PCB’s should duplicate the initial production reflow processes and equipment as close as possible and with the desire to have the operator concentrated on his job without worrying of system continuous readjusts. With the Etneo Hot air systems, the regulation of temperature and hot air flow are totally independent from each other thus enabling variation of the flow yet still keeping a constant temperature, a feature which is essential when working with SMD components. The Air flow can be controlled on the tool by a convenient finger keys (Plus/minus flow keys and GO key), this is a unique feature Etneo proprietary

Unique Virtual nozzle
No need to change nozzle for most sizes components thanks to the Etneo technology

Benefits

  • Ideal for Soldering/Desoldering SMT components
  • Pin pointed controlled flow directed to the target only
  • The operator, thanks to the air tool control can concentrate on his job
  • Minimizes rework time & increases productivity
  • Eliminates: Thermal Stresses and Thermal Shock
  • Non contamination to the delicate ceramic chip resistors, capacitors, and semiconductors
  • Superb for reflowing the delicate leads of fine pitch gull wing devices as the operator never touch the lead or the pad with the tool
  • The best way for touching up and leveling pads

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Etneo Italia Via Bovio no. 6 - 28100 Novara - Italy Tel +39 0321 697.200 - Fax +39 0321 688.515 email - info@etneo.com