New Model 2008
(page in preparation)
Placement - Remove - Align automatic
Fine auto profiling with flow cooling feature
Automatic Bga - Csp Rework Machine - N2 assisted
MAIN FEATURES:
Soldering and Desoldering phases are automatic.
The Operator just inputs the profile parameters by the user friendly
Control Software. - The times and the Temperatures of the profile are
generated by means of 4 + 2 Temp. Sensors, and maintained in the dynamic
data base, they can be recall or edit at any time.
The Air or Gas flows are controlled by pressure and volume. The N2 Option
Filter generator allows the gas to be forced through the heater mantaining
clean the soldering area and eliminating the oxidation, moreover the
soldering temperature can be lowered since the N2 gas is pre-heated
while passing throuh the TOP and/or BOTTOM Heaters. This feature will
make easy and secure any LEAD FREE soldering processes.
The pcb holder is modular and can accept boards up to 600 x 700 mm.
The CCD Colour camera has Autofocus feature built in - the zoom ratio
is controlled by software - the magnification is up 100x. Large components
up to 50 x 50 mm and very small ones can be reworked by the machine.
White bright LEDs provide even and easy lighting .
The optical prism system will rotate to home position automatically, after the component/board pads alignment. Than , the Z nozzle axis will automatically move to start the Soldering or Desoldering process. The opearator monitors the phases process on the PC Video.
Suggestions for a Succesfull Rework
The industrial use has already define as a standard the method of the Air/Gas (duly controlled by flow and temperature), to Rework Bga and Smd components as is allowing consolidated and repetitive results not easyly achieved with other systems /such infrared etc.).The ability to dispense flux and paste to the area to be reworked is very important for the final result of soldering (to avoid Voids and Shorts). One of the simplest methods is to screen the component on the contact side. The Machine made by Etneo, described on the re-balling pages is very useful to that purpose and moreover is a precision machine used to manually apply solder balls to any bga components.
PC Window - Temperatures & Times profile
Nozzles type “MACRO” e “MICRO” (micro BGA)
