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Click   www.semicorp.com -  prodotti - per informazioni dettagliate
Tape		Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing C'è un tape specifico che è perfetto per la Vostra applicazione Consultate il sito www.semicorp.com
Modello 3100 Modello 3150		Wafer/Frame Tape Applicators I Modelli 3100 & 3150 Wafer/Film Frame Tape Applicators sono in grado di applicare i  tape con l'ottimale controllo dei parametri di  temperatura e pressione.
Modello 3200  Modello 3250		Wafer/Backlap Applicator Applies protective tape to your wafer prior to backlapping. Applicatore di tape di protezione.
Modello 410		Flip Chip Die Bonder Aligns and attaches flip chip die onto various substrates. Allinea ed attacca i flip chip su vari substrati.
Modello 850		Flip Chip Placement System A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die.
Modello 860		The New Omni Bonder  A multi-use system which can be configured for bonding laser diodes, flip chip and eutectic bonded die.
Modello 430		Hot Gas Rework Module Hot gas jet directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area.
Modello 4450		Hot Gas Rework Station Hot Gas Rework Station removes surface mounted components and bonded die.
Modello 4750		Die Ejector System (Poker Plate) Speed up die handling.
Modello 4800		Die Ejector Grid Die Ejector Grid System for loosening die for quick, safe removal from wafer mounting tape.
Modello  KTM 83A		Semi-Automatic Pick & Place System Transfers die or other devices from tape or carrier trays to any desired packages.
Modello  KTM 83B		Manual Pick & Place System Pick and Place surface mounted devices from carrier packs onto pre-epoxied surfaces.