Distributed in Italy
| Click on www.semicorp.com - products for detailed information | |||
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| Tape |
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Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing
There is a Semiconductor Equipment Tape that is perfect for your application. |
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Model 3100 Model 3150 |
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Wafer/Frame Tape Applicators Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. |
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Model 3200 Model 3250 |
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Wafer/Backlap Applicator Applies protective tape to your wafer prior to backlapping. |
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| Model 410 |
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Flip Chip Die Bonder Aligns and attaches flip chip die onto various substrates. |
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| Model 850 |
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Flip Chip Placement System A versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. |
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| Model 860 |
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The New Omni Bonder - Nepcon West '99 Debut! A multi-use system which can be configured for bonding laser diodes, flip chip and eutectic bonded die. |
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| Model 430 |
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Hot Gas Rework Module Hot gas jet directs up to 800 º C heated gas through an interchangeable quartz nozzle to a specific area. |
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| Model 4450 |
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Hot Gas Rework Station Hot Gas Rework Station removes surface mounted components and bonded die. |
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| Model 4750 |
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Die Ejector System (Poker Plate) Speed up die handling. |
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| Model 4800 |
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Die Ejector Grid Die Ejector Grid System for loosening die for quick, safe removal from wafer mounting tape. |
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Model KTM 83A |
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Semi-Automatic Pick & Place System Transfers die or other devices from tape or carrier trays to any desired packages. |
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Model KTM 83B |
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Manual Pick & Place System Pick and Place surface mounted devices from carrier packs onto pre-epoxied surfaces. |
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Etneo Italy represents the Semiconductor Equipment Corp. products for the Italian market.
