GAM 70 - Laser Video Measurement Solder paste height
System of Measurement and Control by Laser, of volumes and heights of solder paste (and more), with reports for the development process of production in the Lead Free environment.
Ideal inspection for solder paste thickness, dealing with the increasingly growth of fine pitch, enhanced printing technology and high precision requirement. Prevent virous kinds of defect from printing process, such as the bridging, deviation location, etc... Laser vision measurement, without contact and damage. Statistical charts and process capability index be provided as the real-time data for quality control. Easy to operate, fast gather the printing data for reference. Measure printed solder thickness, height, length and interval. Providing various kind of statistical charts, such as the distributive thickness chart, -R control chart and process capability index: Cp, Cpm ,Cpk for reference. Analyze thickness for solder cross-section. Inspect length and thickness for other kinds of materials
SPECS
Range spot: 2,5 mm x 2 mm Spot: x90 - Metodo: Visione Laser Size: W 350 x L 265 mm Risoluzione: +/- 0.0035 mm Schermo: 15” LCD - Lente CCD - Luce: LED Sistema Operativo: Windows Consumo: 400 VA Dimenzioni: L 350 x W 400 x H 350 mm Peso: 30 Kg
