Easy reballing di qualsiasi package complesso senza l'uso degli stencils

Ball Mounter machine - New Machine - pagina in preparazione

Dettagli: Shooter di sfere - substrato - dosatore di flux - Camera di controllo

The machine has been developed for enabling cost-effective prototyping, low volume production and repair of ball grid array components such as BGA & CSP. The ball placement pattern can simply be designed with Windows based software. A specially designed pick and place nozzle ensure the ball placement accuracy on IC packages or substrates.

FEATURES

• Easy programmable ball placement pattern
• Precision Pick & Place Nozzle
• Simple X Y JOG dial operation for placement position setting
• Multi layer pattern setting is available for the different ball pitch on single package
• Enable 0,2 mm diameter solder ball placement by optional upgrade

SPECIFICATIONS

• Ball diameter 0,75 - 0,3 mm
• Placement accuracy: 50 um (diam. 0,5 mm ball)
• Placement speed: average 0,7 sec
• Table size: 100 x 50 mm
• Placement area: 50 x 50 mm
• CCD Camera: 1/4" Colour
• Magnification range: 20 - 230 X
• Light source: White Colour LED
• Machine size: 513 x 600 x 450 mm - 58 Kg
• Power Source 230 VAC 5A
• Inlet Air: 0,4MPa - 3LPM
• N2 gas: 0,6 LPM

Tool Nozzle - Placement of 0,2 mm Balls